My Resume

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1) Filed Service Engineer, HERMES EPITEK CORPORATION SND. BHD, KEDAH, MALAYSIA (Vendor, Wafer Fabrication Industry) (Since 18 Oct 2006)

· Mainly in-charge and familiar with TEL (Tokyo Electron Limitted) Etcher and familiar with etching process.
· Troubleshoot and repair hardware and software problems.
· Update and release tool/machine hardware, software, and design documentation to accommodate Engineering Change Notice.
· Perform incremental tool/machine design verification and validation and update associated documentation.
· Install new tool/machine and provide startup support and training.
· Promote proper preventative maintenance practices within manufacturing sites.
· Provide test equipment support during manufacturing process validation.
· Understand and follow established quality procedures so as to maintain tool/machine’s design trace-ability.


2) Thin Film Manufacturing Engineer, SILTERRA (M) SDN. BHD, KEDAH, MALAYSIA
(Wafer Fabrication Industry) (9 Aug 2004- 17 Oct 2006)
· Responsible for maximizing wafer moves and product cycle time at Thin Film Dielectric and Metal steps.
· Manage, lead and coach 40 manufacturing technicians to meet production requirements.
· Initiate and conduct meetings between Engineering and Manufacturing group to tackle in line issues and share latest development.
· Follow up with engineering group to improve capacity, tool restrictions and system loopholes based on future business requirement.
. Develop key indices to monitor tool and manpower performance.
· Arrange shipment , prepare paper documentation with logistic department.

Accomplishments:
1)Successfully reduce hold hours for production lots from 20 hours to 8 hours.
2)SERI (Special Engineering Request Run) Template Revision- Further improves of SERI template system for SERI writer/ requester and manufacturing, to brings down the number of misprocess due to unclear SERI.
3)5S Implementation- Main incharge person in Thin Film from beginning implementation of 5S system.

Extra
1)Company ERT (Emergency Respond Team) Member (Strike Team member and Deputy Scriber)

2001-2002 : SHEFFIELD HALLAM UNIVERSITY, SHEFFIELD, UNITED KINGDOM
Bachelor of Engineering (Honours) in Materials and Manufacturing Engineering

1998-2001 : TUNKU ABDUL RAHMAN COLLEGE, KUALA LUMPUR, MALAYSIA
Advanced Diploma in Technology (Materials and Manufacturing Engineering)

1996-1997 : YOK BIN HIGH SCHOOL, MELAKA, MALAYSIA
Certificate of Malaysia’s Higher Education (Equivalent to A-Level)

1990-1995 : MUNSHI ABDULLAH SECONDARY SCHOOL, MELAKA, MALAYSIA
Certificate of Malaysia’s Education (Equivalent to O-Level)