Marlon Professional Resume

To become a member of diverse and multinational company that will challenge my technical skills and competencies

2003ˇV 2008 NXP Semiconductors Inc. Phillipines
Senior Assembly Process Engineer
„XResolved Plating Discoloration Issue (one of the most prominent problem in the semiconductor industry after conversion to Lead Free Chemistry/ Plating)
„XReduced cost in plating chemistry by 40% through introduction and qualification of alternative supplier
„XHandled Process Control Engineering that improve departmentˇ¦s way of working toward use of Statistical Process Control (SPC), Measurement System Analysis (MSA), and Process Failure Mode and Effect
„XOptimized new release package using Design of Experiment (DOE)
„XResolved issues on material quality on leadframe substrate and moulding compound by helping the suppliers to analyze and resolve their issue
„XReduced Customer Complaint on Wirebond by 50% through resolution of issues on lifted wire bond
„XReleased new lines for new package released that expands 500%
„XReleased of Leadfree Plating as demanded by the RoHS and WEEE
„XImproved Over-all Assembly Yield from 97.5% to 98.5%
2000ˇV 2003 Philips Semiconductors Inc. Philippines
Assembly Process Engineer/ Technical Supervisor
„XIncreased plating capacity by 200% through buy-off, qualification and release of new machines
„XReduced plating cost by 20%
„XStandardized system, process and procedure of one department
„XImplemented training course for technicians and operators that double production efficiency
„XReduced material wastes by 20% through proper planning and loading
„XHandled the departmentˇ¦s Safety, Health and Environmental Management
1999ˇV2000 Philips Semiconductors Inc. Philippines
Junior Plating Process Engineer
„XStandardized plating process, systems and procedure
„XImproved Plating Yield by 2%
„XReduced chemical consumption by 20%
„XHandled different plating technology (barrel, reel to reel, strip to strip, batch and wheel plating) using different metal finish (tinlead, pure tin, and electroless nickel)
1997ˇV1999 Philips Semiconductors Inc. Philippines
Cadet Plating Engineer
„XProvided process, system and procedure in the plantˇ¦s plating laboratory
„XReduced laboratory consumption by 20%
1997ˇV1997 National Power Corporation Philippines
Cadet Engineer (trainee)
„XProvided analysis of water and recommendation all through out the process
„X„XScreened incoming banker oil

1993ˇV1997 Mapua Institute of Technology Philippines
„X B.S. Chemical Engineering
„X Graduated as member of the Honor Society of Mapua.
1989ˇV1993 Liceo de San Pablo Philippines
„X Secondary Level
„X Graduated as 2nd Honorable Mention, Mercury Drugs Awardee for Best in Mathematics and Physical Science
1982ˇV1989 San Pablo Colleges Philippines
„X Primary Level

Licensure
1998 Philippine Regulation Commission Philippines
„X Professional Chemical Engineer

Certification and Training
Quality System Management for Auditor/ Lead Auditor, 6 sigma Green Belt, 4 Role of Leadership, Managerial Assessment Centre, Diebond/ Wirebond/ Mould Technology, Code of Conduct, Statistical Engineering, Design of Experiment, Leadership Competency, ISO14001, ISO9001, Business Query, Basic Pneumatics and Electronics, Intensive First Aide, Safety Inspection, Accident Investigation, Interpersonal Competence, QS9000, ELMACOS Planning System, Labor Relation and Labor Code, Interpersonal Management, Time Management, Failure Analysis, Statistical Process Control, Material Science, Technical Paper Writing

Interests

Research and Development, running, working out at gym, computers.